Brand : Essemtec, FOX, Switzerland
SMART-SIZED MODULAR PICK-AND-PLACE
Introducing - The Fox Pack - State of the art technology. Expandable in any direction. The Fox can drive up to 200 feeder, illustrating its dedication to high-mix production. Due to its small footprint and reasonable weight, the machine is ideal for use in limited space production areas even those located on upper floors.
- Placing & dispensing in single pass-through
- Jet dispensing of solder paste or glue
- Up to 7‘000 – 18‘800 cph per module
- Up to 49’600 cph per line (3 modules)
- Up to 200 feeder lanes on 1 sqm
- Up to 420 feeder lanes per line
- No vibration, symmetrical mineral casting
- No warpage, no thermal drift
- Nonstop production, intelligent smart feeder
- Nonstop feeder and production changeover
- Fast, reliable double drive linear motors
- No maintenance, longest lifetime
Essemtec Fox SMT Pick & Place System
|productivity||Optimal placement speed||18'800 cph (4-axis)||12,000 cph (2-axis)||7,000 cph (1-axis)|
|Optimal dosing speed||-||150,000 points / h||-|
|Feeder||Feeder capacity 8 mm tape||200 (140 inline)||180 (120 inline)||180 (120 inline)|
|Components||Components size range||01005 - 33 x 33 mm||(optionally up to 80 x 80 mm)|
|accuracy||Placement accuracy (x, y)||50 μm @ 3σ|
|PCB size||Max. LP size||406 x 305 mm (16 x 12 ")|
|dimension||Machine footprint||880 x 1090 mm (34.7 x 43 ")|
We’d love to help you boost your production efficiency.
A World of Benefits From Npi to
High Flex, High Speed Production
Configurable heads with 1-4 placement-axis.2,5D and 3D dispensing and jetting, High resolution digital vision system with auto component teach-in and irregular ball recognition.
Full operator support - Automated error analysis & KPI. Training, support and troubleshooting via advanced remote access. Investment protection; all options and heads retrofittable.
Multi flexible feeder, multi lane cassette or highly accurate single lane feeder. Tape, Stick, Strip, Tray slider. Largest component spectrum; 008004 up to 80 x 80 mm, component height up to 25 mm.
solder paste jet printing. ( New )
Dynamic Shockwave Technology. Adaptable for different jettable pastes (T4-7). Adaptable for special applications (nozzle, tappet, temperature etc.). Optional needles for deep cavities.
Multitalent Software At Your Fingertips
State of the art, full graphics, 21.5” 16:9 touch screen, Windows – 64 bit, fingertip operation, universal CAD conversion, zoom at camera windows, all-in-one job planning, setup optimisation, stock management, ERP/MES connection, data analysis, line management, traceability down to single component and more
Optional.Laser Height Measurement Compensation of PCB warpage
Dispensing and Jetting Vacuum cleaning station for nozzles and tips
Tray Slider Unique system to increase the amount of trays
Increase Boardsize Table extension to increase the processable board size
Additional: Electrical component test system, vision box to increase component size to be placed, reel-to-reel, bulk components and more