Brand: Essemtec, Switzerland AG
SOLDER PASTE JET PRINTING, GLUE JET PRINTING AND ASSEMBLY ON A SINGLE PLATFORM
Precise and fast! Introducing the flexibility and scalability of PCB production on a minimal floorspace. By combining several processes on a single machine, hundreds of feeder options and a choice of valve options, you can quickly produce and test new electronic designs. Fastest time to market accelerates profitability in the industry through agile job changeover powered by our intuitive ePlace software.
combined all-in-one
- Placement, solder paste & other jet dispensing
- One space saving platform for all processes
process control
- Monitoring sizes, volume & weight of jetted dots
- Process control adjustment and dot stabilisation
highest flexibility
- Improve time to market/ NPI/ Immediate repair
- Decrease of costs (no additional printer or stencils)
adaptive
- Adaptable for different jettable pastes & other media
- Adaptable for special applications (nozzle, tappet etc.)
productivity
- Up to 4 placement-axes and 3 dispense processes
- Dot size of 200-800 μm with the same valve
height mapping
- Adaptable with needles for deep cavities
- Mapping of heights using laser technology
one software for all
- Gerber file conversion and CAD data import
- One click production file generator
We’d love to help you boost your production efficiency. Contact us.
_Specifications_
| Solder Paste Jetting: Shockwave Jet Valve | |
|---|---|
| Viscosity range | < 2’000’000 mPa*s |
| Min. possible dot diameter / volume | > 200 μm / > 1.9 nl |
| Jetting speed Jet-on-the-Fly | Max Frequency: 1’100’000 dots/h BGA Pattern Speed: 665’000 dots/h Average board speed: 350’000 dots/h |
| Useable applications | Solder Paste in electronics, Jetting in cavities and different Z-level, Jetting on populated boards |
| Useable solder pastes | Type 4–7 (jettable), recommended pastes: Indium, WinDot, ... |
| Valve heater | Included, max. 60°C |
| Useable cartridge sizes | 5 ccm / 10 ccm / 30 ccm |
Integrated Inspection System - I2S
From Npi To Mid Range,
Up To Integration In High Speed Lines
This Non-contact jet valve has been developed to jet solder pastes from class 4 to 7, jettable types only. Integrated and combined with a Pick-and-Place process in one of Essemtec's platforms it opens the possibility of an "All-In-One" production, enabling customers full flexibility to process complete PCB's within only one machine.
Time To Market -
No Printer, No Stencils
Freely selectable and combinable settings of jet parameters for optimal adaptation to customer requirements and characteristics of the dispensing material.
The dynamic shockwave technology allows to jet several hundred shots within just a second and with high accuracy and repeatability.
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