The Reflow machine is a very critical part of the SMT process. 90% of defects and reliability issues arise because of reflow, but we have the solution! Kyoritsu Electric Pvt Ltd is introducing a breakthrough technology to the Indian electronics manufacturing market through IBL Löttechnik, Germany’s world-class Vapor Phase Soldering machines, which will help you deal with reflow defects issues.

Vapour Phase Soldering is the only solution for packages like QFN, DFN, BGA, Micro BGA, Package-On-Package specifically used in Army, Air

force, Navy, Aviation and ISRO, where electronics PCBs need high reliability and endurability.

Vapour Phase Soldering uses Galden as an inert medium to heat the PCB and components. The liquid to vapour temperature of Galden is 235°C and it remains stable that thereafter. Due to this, PCB temperature never crosses 235°C, thereby providing very high thermal stability to the PCB laminate, component package and enabling good wetting of solder joint, making it 100% defect-free and void-free.