Brand: Essemtec, PUMA, Switzerland AG

PICK & PLACE AND JET DISPENSING


Introducing - The Puma - State of the art technology. Expandable in any direction. Same as in nature our Puma is common modular and adaptive in all kinds of environment. With different modules the systems grow synchronously with the customer’s requirements for performance and processes. Puma is world's best highspeed Pick-and-Place solution which can also be used in ultraflexible, rapid prototyping development.

Essemtec Puma SMT Pick & Place Machine


_Specifications_

    Puma4 Puma2 Puma
Productivity Optimum placement speed 30’000 cph (4-axes) 17’400 cph (2-axes) 9’000 cph (1-axis)
  Solder Paste Jetting
Shockwave Jet Valve
Jet-on-the-Fly
  Max Frequency: 1’100’000 dots/h
BGA Pattern Speed: 665’000 dots/h
Average board speed: 350’000 dots/h
 
Feeder Feeder capacity 8 mm Tape 280 (160 inline) 260 (140 inline) 260 (140 inline)
Components Component size range   008004 (imp.) - 109 x 87 mm (Note specs for details)  
Accuracy Placement accuracy (x, y)   Chip ± 40 μm (3σ) / QFP ± 30 μm (3σ)  
PCB Max. PCB dimensions   560 x 610 mm (22 x 24“) optional 1’800 x 610 mm (71 x 24“)  
Dimensions Machine footprint   1’557 x 1’357 mm (61 x 53“)  

We’d love to help you boost your production efficiency.
Contact us.

    A World of Benefits From NPI to High Flex, High Speed Production

    puma9

    Solder Paste Jet Printing (New)

    Dynamic Shockwave Technology. Adaptable for different jettable pastes (T4-7). Adaptable for special applications (nozzle, tappet, tempe- rature etc.). Optional needles for deep cavities.


    puma10

    Multitalent Software At Your Fingertips

    State of the art, full graphics, 21.5”, 16:9 HD wide touch screen, fingertip operation, universal CAD conversion, zoom at camera windows, all-in-one job planning, setup optimisation, stock management, ERP/MES connection, data analysis, line management and more.

    Valves and Pumps

    Piezo Jet Shockwave Jet Volume Screw Time-Pressure
    SMD-Adhesives, Underfill,
    Silver Epoxy, UV-Adhesives,
    Globe Top, Encapsulation,
    Dielectric Ink
    Solder Paste,
    Liquid Metal
    Underfill, Gasketing,
    Globe Top, Dam and Fill,
    Solder Paste
    Solder Paste, SMD-Adhesive,
    Globe Top, Encapsulation,
    Silver Epoxy, Dam and Fill
    Gasketing, Globe Top,
    Encapsulation, Solder Paste,
    SMD-Adhesive, Silver Epoxy,
    Dam and Fill
    Low - High Viscosity High Viscosity Low - High Viscosity High Viscosity High Viscosity
    Max Frequency: 2’000’000 dots/h
    BGA Jet-on-the-Fly: 780’000 dots/h
    BGA Stop & Jet: 177’000 dots/h
    Max Frequency: 1’100’000 dots/h
    BGA Jet-on-the-Fly: 665’000 dots/h
    Average Speed: 350’000 dots/h
    26’000 dots/h
    (BGA Pattern*)
    30’000 dots/h
    (BGA Pattern*)
    38’000 dots/h
    (BGA Pattern*)
    * Full Speed, Dot size 0.5 mm, dot matrix 0.8 x 0.8 mm, 1000 dots, medium: Loctite 3621

    Optional Equipment For our Pick-and-Place

    Kyoritsu develops advanced, flexible solutions for electronics manufacturing in close cooperation with customers. These modular mounter platforms are ideally suited for RFNS (Request for Non-Standard) applications. Our engineers assist you in creating customized configurations to enhance precision and productivity in your production line.
     

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