Brand: ViTrox, Malaysia
Advanced 3D X-Ray Inspection (AXI) is designed to specially cater to different sizes of PCB assembly to be examined at a micron level with maximum throughput. This translates to increased production efficiency and cost savings for manufacturers.
We’d love to help you boost your production efficiency. Contact us.
|Allowable Panel Characteristics **||V810i S2EX||V810i S2 XXL||V810i S2 XLT|
|Maximum panel size||482 mm x 610 mm (19″x24″)||660 mm x 965 mm (26″x38″)||660 mm x 965 mm (26″x38″)|
|Minimum panel size||76 mm x 76 mm (3″ x 3″ )||76 mm x 76 mm (3″ x 3″ )||76 mm x 76 mm (3″ x 3″ )|
|Maximum panel inspectable area||474 mm x 610 mm (18.7″x24″)||654 mm x 965 mm (25.75″x38″)||654 mm x 965 mm (25.75″x38″)|
|Maximum panel thickness||7 mm (276 mils)||12.7 mm (500 mils)||12.7 mm (500 mils)|
|Minimum panel thickness||0.5 mm (20 mils)||0.5 mm (20 mils)||0.5 mm (20 mils)|
|Panel warp||Downside < 3.3 mm; Upside < 1.5 mm||Downside < 3.3 mm; Upside < 3.3 mm||Downside < 3.3 mm; Upside < 3.3 mm|
|Maximum panel weight||4.5kg||15kg||15kg|
|Board top clearance||50 mm @ 23 µm resolution||25 mm @ 19 µm resolution||50 mm @ 19 µm resolution|
|38 mm @ 19 µm resolution||15 mm @ 13 µm resolution||31 mm @ 15 µm resolution|
|38 mm @ 10.5 µm# resolution||* Calculated from Board Top surface||13 mm @ 11 µm resolution|
|11 mm @ 11 µm resolution||31 mm @ 10 µm resolution|
|11 mm @ 6 µm# resolution||13 mm @ 7.5 µm resolution|
|* Calculated from Board Top surface||* Calculated from Board Top surface|
|Board bottom clearance||70 mm||80 mm||80 mm|
|Panel edge clearance||3 mm||3 mm||3 mm|
|Panel width tolerance||±0.7 mm||±0.7 mm||±0.7 mm|
|System resolution||23 µm/19 µm#, 11 µm, 10.5µm, 6µm#||19 µm/13 µm||19 µm/15 µm /11 µm/10µm/7.5 µm|
|100% Press-fit testability||Yes (With PSP2 feature)||Yes (With PSP2 feature)||Yes (With PSP2 feature)|
|Maximum acceptable panel temperatures||40 Deg C||40 Deg C||40 Deg C|
|Power and Environmental|
|System footprint (Width X Depth X Height)||1566 mm x 2145 mm x 1972 mm||2240 mm x 2460 mm x 1980 mm||2240 mm x 2460 mm x 1980 mm|
|Weight||~3500 kg||~5500 kg||~6000 kg|
AXI (Automated X-Ray Inspection) is an important method in electronics manufacturing since it allows for extensive and accurate analysis of printed circuit boards (PCBs). We offer advanced automated X-ray inspection machines that provide precise and efficient quality control solutions. Our automated X-ray inspection machines utilize cutting-edge technology, including 3D X-ray inspection systems, to ensure comprehensive analysis of PCBs.
Equipped with high-resolution X-ray cameras and advanced algorithms, our automated X-ray inspection system can detect a wide range of defects, such as solder joint quality, component misalignment, voids, and hidden electrical shorts. The 3D X-ray inspection system captures detailed images, providing valuable insights into the internal structure and integrity of the PCBs.
Our automated X-ray inspection systems are designed for efficiency and ease of use. With intuitive interfaces and user-friendly software, operating these machines is straightforward. Additionally, these systems offer fast inspection speeds, enabling high throughput and optimizing production efficiency.
Investing in our automated X-ray inspection pcb enhances your quality control processes, ensuring reliable and precise analysis of your PCBs. Experience accurate defect detection and improved product reliability with our advanced automated X-ray inspection systems.